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Showing 1 - 12 results of 12 for search '"Packaging"', query time: 0.01s Refine Results
  1. 1
    A study of wire bonded Cu-A1 in microelectronics packaging /
    by Tan, Chee Wei
    Published 2002
    Subjects: “...Microelectronic packaging...”
    Thesis Book
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  2. 2
    Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN /
    by Mohamad Firdaus Rosle
    Published 2010
    Subjects: “...Wire bonding (Electronic packaging)...”
    Thesis Book
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  3. 3
    Kesan atmosfera terubahsuai dan suhu rendah ke atas kecederaan sejuk dan hayat simpanan buah betik (Carica papaya L. kv Eksotika) /
    by Latifah Mohd. Nor
    Published 1995
    Subjects: “...Papaya Packaging....”
    Thesis Book
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  4. 4
    Effect of Libyan marinade and vaccum packaging on quality parameters of Tilapia (Oreochromus niloticus) and Yellowstripe scad (Selaroides leptolepis) fillets during storage /
    Subjects: “...Food Packaging....”
    Thesis Book
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  5. 5
    Pembangunan pakej perisian galakan literasi : pendekatan multimedia /
    Subjects: “...Software packaging...”
    Thesis Microfilm
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  6. 6
    Sensor pH optik daripada bahan boleh dimakan sebagai penunjuk kesegaran makanan berbungkus /
    Subjects: “...Food Packaging....”
    Thesis Book
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  7. 7
    Aruhan toleransi sejuk buah betik melalui perlakuan kejut haba dan kesannya ke atas biosintesis etilena /
    by Nor Hanin Ayub
    Published 2007
    Subjects: “...Papaya Packaging...”
    Thesis Book
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  8. 8
    Pemencilan dan pencirian gen protein kejut haba buah betik (Carica papaya L. cv. Eksotika) dan pengekspresannya semasa penyimpanan sejuk /
    by Sie, Lawrence Eng Kean
    Published 2004
    Subjects: “...Papaya Packaging...”
    Thesis Book
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  9. 9
    Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) /
    by Saidatul Azura Radzi
    Published 2011
    Subjects: “...Wire bonding (Electronic packaging)....”
    Thesis Book
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  10. 10
    Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) /
    by Zainudin Kornain
    Published 2012
    Subjects: “...Electronic packaging....”
    Thesis Book
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  11. 11
    Penerimaan produk makanan tradisi 'Separa Sedia' berasaskan kari di kalangan wanita melayu bekerja di Lembah Kelang /
    by Shamsul Azahari Zainal Badari
    Published 2004
    Subjects: “...Food packaging machinery Industry Malaysia...”
    Thesis Book
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  12. 12
    Penitratan-penyahnitratan biologi menggunakan lapisan biofilem dalam reaktor aerobik :
    by Idham Hamzah
    Published 2001
    Subjects: “...Aerated package treatment systems...”
    Thesis Book
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