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  1. 1
    Improvement on the ball attach process of BGA packages /
    by Thiaga Rajan Muthusamy
    Published 1999
    Subjects: “...Microelectronic packaging...”
    Thesis Book
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  2. 2
    Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) /
    by Zainudin Kornain
    Published 2012
    Subjects: “...Electronic packaging....”
    Thesis Book
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