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Showing 1 - 2 results of 2 for search '"Packaging"', query time: 0.01s Refine Results
  1. 1
    Development of non-post mold cure alternative for semiconductor packaging /
    by Tan, Sook Wai
    Published 1997
    Subjects: “...Microelectronic packaging....”
    Thesis Book
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  2. 2
    An analysis of the epoxy molding compound industry /
    by Chin, Neep Hing
    Published 1997
    Subjects: “...Electronic packaging Materials...”
    Thesis Book
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