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Showing 1 - 10 results of 10 for search '"Packaging"', query time: 0.01s Refine Results
  1. 1
    A study of wire sweep during transfer molding on plastic IC packaging /
    by Wu, Jianhua
    Published 1996
    Subjects: “...Integrated circuits Packaging...”
    Thesis Book
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  2. 2
    Investigation of mechanical properties of paper-based packaging materials /
    by Masni-Azian Akiah
    Published 2011
    Subjects: “...Paper Packaging Materials....”
    Thesis Book
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  3. 3
    Study of alternative packaging materials for semiconductor devices /
    by Suprammaniam, Sugumar
    Published 1997
    Subjects: “...Microelectronic packaging. Materials....”
    Thesis Book
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  4. 4
    Material characterization of soft solder die attaches for power ICs /
    by Wee, Seng Kee
    Published 1996
    Subjects: “...Microelectronic packaging. Materials....”
    Thesis Book
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  5. 5
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    by Prakash Babu Balakrishnan
    Published 2012
    Subjects: “...Electronic packaging Materials....”
    Thesis Book
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  6. 6
    Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
    by Low, Pui Leng
    Published 2020
    Subjects: “...Microelectronic packaging Materials....”
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    Thesis Book
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  7. 7
    Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /
    by Tay, See Leng
    Published 2011
    Subjects: “...Electronic packaging Materials....”
    Thesis Book
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  8. 8
    Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /
    by Wakeel, Saif
    Published 2021
    Subjects: “...Electronic packaging Materials....”
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  9. 9
    An analysis of the epoxy molding compound industry /
    by Chin, Neep Hing
    Published 1997
    Subjects: “...Electronic packaging Materials...”
    Thesis Book
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  10. 10
    Preparation and characterization of copper/copper-coated silicon carbide composites for electronic packaging /
    by Azida Azmi
    Published 2012
    Subjects: “...Electronic packaging Materials....”
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