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  1. 41
    The effect of microstructural properties of bonding wires on performance of wirebond interconnect /
    by Ghazali Omar
    Published 2005
    Subjects: “...Wire bonding (Electronic packaging)...”
    Thesis Book
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  2. 42
    Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN /
    by Mohamad Firdaus Rosle
    Published 2010
    Subjects: “...Wire bonding (Electronic packaging)...”
    Thesis Book
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  3. 43
    An Expert System for Trouble Shooting - Auto Wire Bonder Machine
    by Ng, Yu Ting
    Published 1997
    Subjects: “...Wire bonding (Electronic packaging) - Case studies...”
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  4. 44
    Improved Multicrossover Genetic Algorithm For Twodimensional Rectangular Bin Packing Problem
    by Sarabian, Maryam
    Published 2010
    Subjects: “...Packaging...”
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  5. 45
    Applications of pullulan active packaging incorporated with green synthesized curcumin (C-AgNPs) and pullulan (P-AgNPs) mediated silver nanoparticles on quality of broiler meat
    by Muhammad, Jamshed
    Published 2021
    Subjects: “...Food - Packaging...”
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  6. 46
    Kesan atmosfera terubahsuai dan suhu rendah ke atas kecederaan sejuk dan hayat simpanan buah betik (Carica papaya L. kv Eksotika) /
    by Latifah Mohd. Nor
    Published 1995
    Subjects: “...Papaya Packaging....”
    Thesis Book
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  7. 47
    A study on visual communication kinder soaps packaging design / Wan Nurfathirah Haini Wan Noraziman
    Subjects: “...Packaging...”
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  8. 48
    Assessment of antibacterial and antioxidant properties of torch ginger (Etlingera elatior Jack) inflorescence essential oil in starch-based edible film for chicken meat packaging
    by Marzlan, Anis Asyila
    Published 2021
    Subjects: “...Meat - Packaging...”
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  9. 49
    Improvement on the ball attach process of BGA packages /
    by Thiaga Rajan Muthusamy
    Published 1999
    Subjects: “...Microelectronic packaging...”
    Thesis Book
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  10. 50
    Hygrothermally-induced delamination and cracking in plastic IC packages /
    by Lin, Tingyu
    Published 1999
    Subjects: “...Plastics in packaging Fracture...”
    Thesis Book
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  11. 51
    Study on mold compound conversion from glob material for semiconductor ball grid array packaging /
    by Prakash Babu Balakrishnan
    Published 2012
    Subjects: “...Electronic packaging Materials....”
    Thesis Book
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  12. 52
    Effect of Libyan marinade and vaccum packaging on quality parameters of Tilapia (Oreochromus niloticus) and Yellowstripe scad (Selaroides leptolepis) fillets during storage /
    Subjects: “...Food Packaging....”
    Thesis Book
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  13. 53
    Application of Focus Improvement to Reduce Non-Stick on Pad Problem in IC Packaging
    by Dharmalingam, Sivakumar
    Published 2004
    Subjects: “...Microelectronic packaging - Total roduction maintenance - Case studies...”
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  14. 54
    Curing characterization of pressureless sintered die attach material as leadfree salution in microelectronics packaging /
    by Low, Pui Leng
    Published 2020
    Subjects: “...Microelectronic packaging Materials....”
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  15. 55
    A study on the problem packaging design of local traditional cookies case study: Biskut Kelapa Mama / Nur Syakira Mohd Rashid
    by Mohd Rashid, Nur Syakira
    Published 2018
    Subjects: “...Packaging...”
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  16. 56
    Pembangunan pakej perisian galakan literasi : pendekatan multimedia /
    Subjects: “...Software packaging...”
    Thesis Microfilm
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  17. 57
    Environmental impact of food packaging / Aida Sajidah Ismail
    by Ismail, Aida Sajidah
    Published 2022
    Subjects: “...Packaging...”
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  18. 58
    Effect of free air ball (FAB) formation on wire bond integrity in palladium coated copper (PdCu) wire /
    by Mohd Firdaus Manap
    Published 2017
    Subjects: “...Wire bonding (Electronic packaging)...”
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  19. 59
    Kinetic growth of copper oxidation in semiconductor packaging /
    by Siti Rahmah Esa
    Published 2017
    Subjects: “...Microelectronic packaging....”
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  20. 60
    The effects of annealing, temperature and humidity on tin whiskers formation /
    by Lee, Hua Xing
    Published 2009
    Subjects: “...Electronic packaging....”
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