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  1. 61
    Development of Bulk Packaging and Storage of Shallot (Allium Ascalonium) Puree
    by Ahmad, Noor Azizah
    Published 2008
    Subjects: “...Shallot - Packaging - Case studies...”
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  2. 62
    Susceptor Packaging Material For Baking Flaky Pastry Dough In Microwave Oven
    by Main, Nor Mazlana
    Published 2008
    Subjects: “...Food - Packaging...”
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  3. 63
    Heuristic Placement Routines For Two-Dimensional Rectangular Bin Packing Problems
    by Wong, Lily
    Published 2009
    Subjects: “...Heuristic programming - Bins - Combinatorial packaging and covering - Case studies...”
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  4. 64
    Development of active bilayer packaging films incorporated with mangosteen pericarp extract and their application in packaging of palm oil
    by Brahim, Nabilah
    Published 2018
    Subjects: “...Palm oil - Packaging...”
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  5. 65
    Brand identity in packaging design (BOH Tea)
    Subjects: “...Packaging -- Design...”
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  6. 66
    Comparison of pressure-assist silver sintering to tin silver solder alloy as die attach material in high power semiconductor /
    by Tolentino, Erik Nino
    Published 2020
    Subjects: “...Microelectronic packaging....”
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  7. 67
    Optimization of gel dispensing process in pressure sensor assembly /
    by Shukri Nizam Mohamed Radzi
    Published 2010
    Subjects: “...Wire bonding (Electronic packaging)....”
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  8. 68
    The impact of visual elements on Kula cakes packaging design / Nor Fazlyn Zulkefly
    by Zulkefly, Nor Fazlyn
    Published 2022
    Subjects: “...Packaging...”
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  9. 69
    Development of non-post mold cure alternative for semiconductor packaging /
    by Tan, Sook Wai
    Published 1997
    Subjects: “...Microelectronic packaging....”
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  10. 70
    Effects of nickel and cobalt nanoparticle additions to Sn-Ag-Cu solder /
    by Tay, See Leng
    Published 2011
    Subjects: “...Electronic packaging Materials....”
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  11. 71
    Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package /
    by Wakeel, Saif
    Published 2021
    Subjects: “...Electronic packaging Materials....”
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  12. 72
    An analysis of the epoxy molding compound industry /
    by Chin, Neep Hing
    Published 1997
    Subjects: “...Electronic packaging Materials...”
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  13. 73
    Leaching of bisphenol (A) into drinking water in polycarbonate bottles / Nur Munirah Mustafa
    by Mustafa, Nur Munirah
    Published 2013
    Subjects: “...Packaging...”
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  14. 74
    Sensor pH optik daripada bahan boleh dimakan sebagai penunjuk kesegaran makanan berbungkus /
    Subjects: “...Food Packaging....”
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  15. 75
    Aruhan toleransi sejuk buah betik melalui perlakuan kejut haba dan kesannya ke atas biosintesis etilena /
    by Nor Hanin Ayub
    Published 2007
    Subjects: “...Papaya Packaging...”
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  16. 76
    Development of a plastic packaging waste reduction model for Malaysia using hierarchical approach /
    by Liew, Kar Yin
    Published 2017
    Subjects: “...Packaging....”
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  17. 77
    Study of compression behaviour and mechanical properties of paper pulp packaging using FEA /
    by Munirati Ahmad
    Published 2012
    Subjects: “...Wood-pulp Packaging....”
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  18. 78
    Structural analysis of flexible packaging industry in Malaysia /
    by Lim, Bee Leong
    Published 1995
    Subjects: “...Package goods industry Malaysia....”
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  19. 79
    Development of high-temperature lead-free solder for semiconductor chip attachment /
    by Haque, Ashraful
    Published 2011
    Subjects: “...Microelectronic packaging....”
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  20. 80
    Preparation and characterization of copper/copper-coated silicon carbide composites for electronic packaging /
    by Azida Azmi
    Published 2012
    Subjects: “...Electronic packaging Materials....”
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