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Showing 1 - 11 results of 11 for search '"Wire bonding (Electronic packaging)"', query time: 0.02s Refine Results
  1. 1
    The effect of microstructural properties of bonding wires on performance of wirebond interconnect /
    by Ghazali Omar
    Published 2005
    Subjects: “...Wire bonding (Electronic packaging)...”
    Thesis Book
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  2. 2
    An Expert System for Trouble Shooting - Auto Wire Bonder Machine
    by Ng, Yu Ting
    Published 1997
    Subjects: “...Wire bonding (Electronic packaging) - Case studies...”
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  3. 3
    First bonding parameter optimization in wire bonding process /
    Subjects: “...Wire bonding (Electronic packaging)...”
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  4. 4
    Effect of free air ball (FAB) formation on wire bond integrity in palladium coated copper (PdCu) wire /
    by Mohd Firdaus Manap
    Published 2017
    Subjects: “...Wire bonding (Electronic packaging)...”
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  5. 5
    Optimization of gel dispensing process in pressure sensor assembly /
    by Shukri Nizam Mohamed Radzi
    Published 2010
    Subjects: “...Wire bonding (Electronic packaging)....”
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  6. 6
    Optimization and reliability of wirebond looping profile for broken neck failure /
    by Teoh, Cheng Lock
    Published 2012
    Subjects: “...Wire bonding (Electronic packaging) Production control....”
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  7. 7
    Study of improvement in wire bonding process through critical parameters analysis /
    by Ong, Siew Kee
    Published 2011
    Subjects: “...Wire bonding (Electronic packaging)....”
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  8. 8
    Study of the effect of process variation on wire bond process of IC assembly /
    by Intan Mastura Saadon
    Published 2012
    Subjects: “...Wire bonding (Electronic packaging)....”
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  9. 9
    Thermal-mechanical analysis of bonding pad in insulated gate bipolar transistor
    Subjects: “...Wire bonding (Electronic packaging)...”
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  10. 10
    Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN /
    by Mohamad Firdaus Rosle
    Published 2010
    Subjects: “...Wire bonding (Electronic packaging)...”
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  11. 11
    Kesan kombinasi arus elektrik dan daya lekatan bagi proses lekatan wayar termosonik pakej dai bertingkat 3D quad flat nolead (QFN) /
    by Saidatul Azura Radzi
    Published 2011
    Subjects: “...Wire bonding (Electronic packaging)....”
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