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Chin, Yoong Tatt
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Chin, Yoong Tatt
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Chin, Yoong Tatt
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Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement
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Chin
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Yoong
Tatt
Published 2002
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Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders
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Chin
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Yoong
Tatt
Published 2014
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