A study of wire bonded Cu-A1 in microelectronics packaging /

A study of wire bonded Cu-A1 in microelectronics packaging /

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書目詳細資料
主要作者:	Tan, Chee Wei
格式:	Thesis 圖書
語言:	English
出版:	Bangi : Fakulti Sains dan Teknologi, Universiti Kebangsaan Malaysia, 2002
主題:	Universiti Kebangsaan Malaysia > Dissertations Microelectronic packaging Microeclectronic packaging > Technological innovations
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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