Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) /

Keboleharapan bebola pateri Sn-Ag-Cu (SAC) tanpa plumbum untuk pakej susunan grid bebola (BGA) /

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书目详细资料
主要作者:	Ibrahim Ahmad
格式:	Thesis 图书
语言:	Malay
出版:	Bangi : Fakulti Kejuruteraan, Universiti Kebangsaan Malaysia, 2007
主题:	Universiti Kebangsaan Malaysia > Dissertations Dissertations, Academic > Malaysia Lead free electronics manufacturing processes Solder and soldering Alloys
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