Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN /

Pengoptimuman keadaan perlekatan dai dan perlekatan bebola termosonik terhadap prestasi pakej dai bertingkat 3D QFN /

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书目详细资料
主要作者:	Mohamad Firdaus Rosle
格式:	Thesis 图书
语言:	Malay
出版:	2010
主题:	Universiti Kebangsaan Malaysia > Dissertations Wire bonding (Electronic packaging) Electronic packaging Dissertations, Academic > Malaysia
标签:	添加标签没有标签, 成为第一个标记此记录!

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