Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) /

Penyelesaian kegagalan pada isian bawah dalam pakej cip balikan tatasusun grid bebola (FC-BGA) /

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書目詳細資料
主要作者:	Zainudin Kornain
格式:	Thesis 圖書
語言:	Malay
出版:	2012.
主題:	Universiti Kebangsaan Malaysia > Dissertations. Dissertations, Academic > Malaysia. Flip chip technology. Electronic packaging. Ball grid array technology.
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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