Thermomechanical study of lead-free solder joints and the effects of carbon-based additives
The trend of miniaturization is inevitable in the electronics assembly. However, scaling down of the electronics assembly does not only involve the components substrate and packaging, the solder balls dimension and pitch size need to be taken into account as well. In the first part of the study, the...
Saved in:
| 主要作者: | |
|---|---|
| 格式: | Thesis |
| 出版: |
2019
|
| 主題: | |
| 標簽: |
添加標簽
沒有標簽, 成為第一個標記此記錄!
|