Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding

Development, Implementation And Analysis Of Direct Integration Offline Method In Wire Bonding

In this work, a wire bonding path creation method using computer-aided design information is developed to support the wire bonding process. This method is named as Direct Integration Offline Programming (Di-OLP). The Di-OLP utilizes numerical coordinate data extracted from bonding diagram creation s...

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書目詳細資料
主要作者:	Lee, Foo Yeong
格式:	Thesis
出版:	2011
主題:	TK7800-8360 Electronics
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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