Optimal modeling fill guide for improved interconnect performance

Chemical mechanical polishing (CMP) planarization process is an important step in fabrication for multi-layer metallization to create and design IC metallization and via interconnections. Fill synthesis methodologies are innovated by inserting dummy fill structures into the surrounding functional in...

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Bibliographic Details
Main Author: Yeo, Joel Yee Kiat
Format: Thesis
Published: 2012
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