Optimal modeling fill guide for improved interconnect performance

Optimal modeling fill guide for improved interconnect performance

Chemical mechanical polishing (CMP) planarization process is an important step in fabrication for multi-layer metallization to create and design IC metallization and via interconnections. Fill synthesis methodologies are innovated by inserting dummy fill structures into the surrounding functional in...

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書目詳細資料
主要作者:	Yeo, Joel Yee Kiat
格式:	Thesis
出版:	2012
主題:	TK7800-8360 Electronics
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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