Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders

Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders

The aim of this thesis includes study the interfacial interactions of Lead-free solders (Pb-free) with the ENIG surface finish and its impact to brittle fracture of the solder joints. Selection of Pb-free solders through optimization the percentage composition of Sn-Ag-Cu solders and its alloying ad...

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Main Author: Chin, Yoong Tatt
Format: Thesis
Published: 2014
Subjects:
TK7800-8360 Electronics
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id my-mmu-ep.5763
record_format uketd_dc
spelling my-mmu-ep.57632014-09-30T03:52:06Z Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders 2014-01 Chin, Yoong Tatt TK7800-8360 Electronics The aim of this thesis includes study the interfacial interactions of Lead-free solders (Pb-free) with the ENIG surface finish and its impact to brittle fracture of the solder joints. Selection of Pb-free solders through optimization the percentage composition of Sn-Ag-Cu solders and its alloying additions to provide resistant to Mechanical shock performance. It is desirable that some solder alloying design rules may be formulated to minimize the formation of interfacial defects (nano voids). Based on the data collected, a diffusion model will be constructed using Numerical Analysis to provide an understanding of the mechanism of nano-void formation. 2014-01 Thesis http://shdl.mmu.edu.my/5763/ http://library.mmu.edu.my/diglib/onlinedb/dig_lib.php phd doctoral Multimedia University Faculty of Engineering
institution Multimedia University
collection MMU Institutional Repository
topic TK7800-8360 Electronics
spellingShingle TK7800-8360 Electronics
Chin, Yoong Tatt
Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders
description The aim of this thesis includes study the interfacial interactions of Lead-free solders (Pb-free) with the ENIG surface finish and its impact to brittle fracture of the solder joints. Selection of Pb-free solders through optimization the percentage composition of Sn-Ag-Cu solders and its alloying additions to provide resistant to Mechanical shock performance. It is desirable that some solder alloying design rules may be formulated to minimize the formation of interfacial defects (nano voids). Based on the data collected, a diffusion model will be constructed using Numerical Analysis to provide an understanding of the mechanism of nano-void formation.
format Thesis
qualification_name Doctor of Philosophy (PhD.)
qualification_level Doctorate
author Chin, Yoong Tatt
author_facet Chin, Yoong Tatt
author_sort Chin, Yoong Tatt
title Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders
title_short Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders
title_full Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders
title_fullStr Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders
title_full_unstemmed Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders
title_sort investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders
granting_institution Multimedia University
granting_department Faculty of Engineering
publishDate 2014
_version_ 1747829588738703360

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