Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders
The aim of this thesis includes study the interfacial interactions of Lead-free solders (Pb-free) with the ENIG surface finish and its impact to brittle fracture of the solder joints. Selection of Pb-free solders through optimization the percentage composition of Sn-Ag-Cu solders and its alloying ad...
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| 格式: | Thesis |
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2014
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