Investigation On Inter-Layer Dielectric Processed By Chemical Mechanical Polishing And Spin-On Dielectric For Complementary Metal-Oxide-Semiconductor Compatible Devices
Surface planarization of the thin film layers that constitute the interconnects in the backend process of integrated circuit (IC) has become a critical need with the increasing number of metal levels. Planarization, globally and locally, needs to be achieved using the most efficient planarization me...
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2016
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