Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement

Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement

This project is to study the physical and thermo-mechanical of various underfills materials and its integration to the flip chip package. The objective of the project was accomplish by identifying key influencing factors in the underfill materials to meet 260 celsius high temperature reflow conditio...

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Bibliographic Details
Main Author: Chin, Yoong Tatt
Format: Thesis
Published: 2002
Subjects:
TK7800-8360 Electronics
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spelling my-mmu-ep.9652010-07-15T06:43:24Z Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement 2002-09 Chin, Yoong Tatt TK7800-8360 Electronics This project is to study the physical and thermo-mechanical of various underfills materials and its integration to the flip chip package. The objective of the project was accomplish by identifying key influencing factors in the underfill materials to meet 260 celsius high temperature reflow condition. 2002-09 Thesis http://shdl.mmu.edu.my/965/ http://myto.perpun.net.my/metoalogin/logina.php masters Multimedia University Research Library
institution Multimedia University
collection MMU Institutional Repository
topic TK7800-8360 Electronics
spellingShingle TK7800-8360 Electronics
Chin, Yoong Tatt
Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement
description This project is to study the physical and thermo-mechanical of various underfills materials and its integration to the flip chip package. The objective of the project was accomplish by identifying key influencing factors in the underfill materials to meet 260 celsius high temperature reflow condition.
format Thesis
qualification_level Master's degree
author Chin, Yoong Tatt
author_facet Chin, Yoong Tatt
author_sort Chin, Yoong Tatt
title Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement
title_short Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement
title_full Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement
title_fullStr Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement
title_full_unstemmed Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement
title_sort study of flip chip underfill materials to meet 260 celsius high temperature reflow requirement
granting_institution Multimedia University
granting_department Research Library
publishDate 2002
_version_ 1747829274487816192

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