Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement
This project is to study the physical and thermo-mechanical of various underfills materials and its integration to the flip chip package. The objective of the project was accomplish by identifying key influencing factors in the underfill materials to meet 260 celsius high temperature reflow conditio...
محفوظ في:
المؤلف الرئيسي: | Chin, Yoong Tatt |
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التنسيق: | أطروحة |
منشور في: |
2002
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الموضوعات: | |
الوسوم: |
إضافة وسم
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
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مواد مشابهة
-
Lead Electromigration In Flip Chip Packaging Under Hast Environment
بواسطة: Wong, Shaw Hwang
منشور في: (2004) -
Effects Of Oxygen Concentration On Solder Joints During Reflow Soldering
بواسطة: Chung, Chee Key
منشور في: (2003) -
Thermal Investigations Of Flip Chip Microelectronic Package With Non-Uniform Power Distribution [TK7874. G614 2004 f rb]
[Microfiche 7607].
بواسطة: Goh, Teck Joo
منشور في: (2004) -
Investigation of brittle fractures, interfacial kinetics and void formation in lead-free solders
بواسطة: Chin, Yoong Tatt
منشور في: (2014) -
Numerical Analysis During Encapsulation Process Of Molded Underfill With Multi Flip Chip Package
بواسطة: Azmi, Muhammad Afiq
منشور في: (2018)