Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement

Study Of Flip Chip Underfill Materials To Meet 260 Celsius High Temperature Reflow Requirement

This project is to study the physical and thermo-mechanical of various underfills materials and its integration to the flip chip package. The objective of the project was accomplish by identifying key influencing factors in the underfill materials to meet 260 celsius high temperature reflow conditio...

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主要作者:	Chin, Yoong Tatt
格式:	Thesis
出版:	2002
主题:	TK7800-8360 Electronics
标签:	添加标签没有标签, 成为第一个标记此记录!

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