Study Of The Interaction Between The Functions Of Grit Size And Residual Damage Of An Ultra Thin Wafer
Wafer thinning operation's parameters such as grit size, spindle speed, feed rate, tape material and the wafer handling mechanism are becoming very critical as the wafer becomes thinner. Temperature also plays a role in determining the amount of residual stresses on the wafers post thinning. T...
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2002
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