Intermetallic thickness and physical studies of Sn-3.5Ag-1.0Cu lead free solder with ni addition / Noor Asikin Ab Ghani
Due to the environmental and health concern, the use o f lead free solder has been introduced in 2000 by National Electronics Manufacturing Initiative (NEMI) to replace the tin-lead (Sn-Pb) solder. Among many lead free solders, the tin-silvercopper (Sn-3.5Ag-l.0Cu) is a potential replacement for Sn-...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2016
|
| Subjects: | |
| Online Access: | https://ir.uitm.edu.my/id/eprint/27206/1/TM_NOOR%20ASIKIN%20AB%20GHANI%20AS%2016_5.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|