Characterization of defects generated by copper electrochemical plating process on silicon wafers / Yasmin Abdul Wahab
With the rapid adoption of dual-damascene copper (CuDD) processing as semiconductor device features shrink into deep-submicron process, the copper electrochemical plating (ECP) is emerging as one choice for Cu metallization in multilevel interconnects. Copper processing has brought about an increase...
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| Format: | Thesis |
| Language: | English |
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2008
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| Online Access: | https://ir.uitm.edu.my/id/eprint/27660/1/TM_YASMIN%20ABDUL%20WAHAB%20EE%2008_5.pdf |
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