Activation energy study of intermetallic with the addition of graphene nanosheets into Sn-3.5Ag lead-free solder / Amirah Salleh
Sn-Pb solder has been used in electronic industry as interconnection for electronic packaging but Pb has been restricted as it high in toxicity which can harmful to human health and environment. Due to harmful effect, many research have been done in order to find a suitable replacement for the lead...
محفوظ في:
| المؤلف الرئيسي: | |
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| التنسيق: | أطروحة |
| اللغة: | English |
| منشور في: |
2021
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| الموضوعات: | |
| الوصول للمادة أونلاين: | https://ir.uitm.edu.my/id/eprint/60096/1/60096.pdf |
| الوسوم: |
إضافة وسم
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