Activation energy study of intermetallic with the addition of graphene nanosheets into Sn-3.5Ag lead-free solder / Amirah Salleh

Sn-Pb solder has been used in electronic industry as interconnection for electronic packaging but Pb has been restricted as it high in toxicity which can harmful to human health and environment. Due to harmful effect, many research have been done in order to find a suitable replacement for the lead...

Full description

Saved in:
Bibliographic Details
Main Author: Salleh, Amirah
Format: Thesis
Language:English
Published: 2021
Subjects:
Online Access:https://ir.uitm.edu.my/id/eprint/60096/1/60096.pdf
Tags: Add Tag
No Tags, Be the first to tag this record!