Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering.
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| Main Author: | |
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| Format: | UMK Etheses |
| Language: | English |
| Published: |
2021
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| Online Access: | http://discol.umk.edu.my/id/eprint/10777/ http://discol.umk.edu.my/id/eprint/10777/1/MUHAMMAD%20IQBAL%20AHMAD.pdf |
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