Ahmad, M. I. (2021). Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering.
Chicago Style (17th ed.) CitationAhmad, Muhammad Iqbal. Thermal Fluid-structure Interaction Analysis on Flexible Printed Circuit Board During Reflow Soldering. 2021.
MLA (8th ed.) CitationAhmad, Muhammad Iqbal. Thermal Fluid-structure Interaction Analysis on Flexible Printed Circuit Board During Reflow Soldering. 2021.
Warning: These citations may not always be 100% accurate.