APA (7th ed.) Citation

Ahmad, M. I. (2021). Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering.

Chicago Style (17th ed.) Citation

Ahmad, Muhammad Iqbal. Thermal Fluid-structure Interaction Analysis on Flexible Printed Circuit Board During Reflow Soldering. 2021.

MLA (8th ed.) Citation

Ahmad, Muhammad Iqbal. Thermal Fluid-structure Interaction Analysis on Flexible Printed Circuit Board During Reflow Soldering. 2021.

Warning: These citations may not always be 100% accurate.