Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering.
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Format: | UMK Etheses |
Language: | English |
Published: |
2021
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Online Access: | http://discol.umk.edu.my/id/eprint/10777/ http://discol.umk.edu.my/id/eprint/10777/1/MUHAMMAD%20IQBAL%20AHMAD.pdf |
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institution |
Universiti Malaysia Kelantan |
collection |
UMK Digital Special Collection |
language |
English |
format |
UMK Etheses |
author |
Muhammad Iqbal Ahmad |
spellingShingle |
Muhammad Iqbal Ahmad Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. |
author_facet |
Muhammad Iqbal Ahmad |
author_sort |
Muhammad Iqbal Ahmad |
title |
Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. |
title_short |
Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. |
title_full |
Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. |
title_fullStr |
Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. |
title_full_unstemmed |
Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. |
title_sort |
thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. |
publishDate |
2021 |
url |
http://discol.umk.edu.my/id/eprint/10777/ http://discol.umk.edu.my/id/eprint/10777/1/MUHAMMAD%20IQBAL%20AHMAD.pdf |
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