Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering.
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| Main Author: | |
|---|---|
| Format: | UMK Etheses |
| Language: | English |
| Published: |
2021
|
| Online Access: | http://discol.umk.edu.my/id/eprint/10777/ http://discol.umk.edu.my/id/eprint/10777/1/MUHAMMAD%20IQBAL%20AHMAD.pdf |
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| id |
my-umk-ep.10777 |
|---|---|
| record_format |
uketd_dc |
| spelling |
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| institution |
Universiti Malaysia Kelantan |
| collection |
UMK Digital Special Collection |
| language |
English |
| format |
UMK Etheses |
| author |
Muhammad Iqbal Ahmad |
| spellingShingle |
Muhammad Iqbal Ahmad Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. |
| author_facet |
Muhammad Iqbal Ahmad |
| author_sort |
Muhammad Iqbal Ahmad |
| title |
Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. |
| title_short |
Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. |
| title_full |
Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. |
| title_fullStr |
Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. |
| title_full_unstemmed |
Thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. |
| title_sort |
thermal fluid-structure interaction analysis on flexible printed circuit board during reflow soldering. |
| publishDate |
2021 |
| url |
http://discol.umk.edu.my/id/eprint/10777/ http://discol.umk.edu.my/id/eprint/10777/1/MUHAMMAD%20IQBAL%20AHMAD.pdf |
| _version_ |
1748404127656837120 |