Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad

The advancement of technology in the micro and nano electronic niche has changed the aspects of interconnection of electrical connectivity. Surface adhesion of electronic device fabrication has propelled tribology element on layers and bonding of this devices as an important element. Surface roug...

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Bibliographic Details
Main Author: Vithyacharan, Retnasamy
Format: Thesis
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