Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad

The advancement of technology in the micro and nano electronic niche has changed the aspects of interconnection of electrical connectivity. Surface adhesion of electronic device fabrication has propelled tribology element on layers and bonding of this devices as an important element. Surface roug...

Full description

Saved in:

Bibliographic Details
Main Author:	Vithyacharan, Retnasamy
Format:	Thesis
Language:	English
Subjects:	Gold ball bonds Aluminum bond pad Surface adhesion Surface roughness Gold wire bonding
Online Access:	http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33139/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33139/2/Full%20text.pdf
Tags:	Add Tag No Tags, Be the first to tag this record!

id	my-unimap-33139
record_format	uketd_dc
spelling	my-unimap-331392014-03-26T04:47:14Z Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad Vithyacharan, Retnasamy The advancement of technology in the micro and nano electronic niche has changed the aspects of interconnection of electrical connectivity. Surface adhesion of electronic device fabrication has propelled tribology element on layers and bonding of this devices as an important element. Surface roughness has been an integral part of macro electromechanical systems, in the advent of microelectronics surface roughness has been again a focus research area. In this work, a study on surface roughness attribute in gold ball adhesion on aluminium bond pad was investigated. Using design of experiment approach (DOE), bond force as a critical to function parameter was chosen in this work to study surface roughness influence. A range of different surface roughness of aluminium bond pad on pieces of wafer was created using different plasma settings. Using three different values of bond force, multiple gold ball bonding were performed on the series of different surface roughness on aluminium bond pad for three trials. A modified box-plot was plotted for average ball shear value against surface roughness range. All three trials depicted similar polynomial plot trend with a leading negative coefficient. Using simple differentiation coupled with the standard deviation value from the trials, an optimized range for surface roughness was obtained from the equations created. The optimized ranges of surface roughness deduced from this experiment were from 2.10 nm till 6.38 nm. A final footprint experiment was done to understand and correlate to the ball shear experiments. The footprint experiment shows a better understanding of adhesion without shear value. Footprint adhesion scales were tabled and ranked, using this footprint adhesion plot against surface roughness was plotted. The plot depicted similar polynomial trend as the previous experiments. The highest footprint adhesion was also within the range obtained previously. The adhesion of footprint more than 80% gold ball remnant on the aluminium bond pad were within the optimized surface roughness range of 2.10 nm till 6.38 nm. It can be finally concluded that surface roughness at micro level becomes an important critical attribute to ensure the wire bond quality. The experimental approach has also given new means of obtaining the suitable optimized surface roughness range for a quality and robust wire bond adhesion onto bond pads. The work has successfully established surface roughness importance in the wire bonding process. Universiti Malaysia Perlis (UniMAP) 2013 Thesis en http://dspace.unimap.edu.my:80/dspace/handle/123456789/33139 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33139/3/license.txt 8a4605be74aa9ea9d79846c1fba20a33 http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33139/1/Page%201-24.pdf 0531c68a334654fa1f0c44f1394fdd2c http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33139/2/Full%20text.pdf 3c380a81cc7518a207669b8d53b42c22 Gold ball bonds Aluminum bond pad Surface adhesion Surface roughness Gold wire bonding School of Microelectronic Engineering
institution	Universiti Malaysia Perlis
collection	UniMAP Institutional Repository
language	English
topic	Gold ball bonds Aluminum bond pad Surface adhesion Surface roughness Gold wire bonding
spellingShingle	Gold ball bonds Aluminum bond pad Surface adhesion Surface roughness Gold wire bonding Vithyacharan, Retnasamy Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad
description	The advancement of technology in the micro and nano electronic niche has changed the aspects of interconnection of electrical connectivity. Surface adhesion of electronic device fabrication has propelled tribology element on layers and bonding of this devices as an important element. Surface roughness has been an integral part of macro electromechanical systems, in the advent of microelectronics surface roughness has been again a focus research area. In this work, a study on surface roughness attribute in gold ball adhesion on aluminium bond pad was investigated. Using design of experiment approach (DOE), bond force as a critical to function parameter was chosen in this work to study surface roughness influence. A range of different surface roughness of aluminium bond pad on pieces of wafer was created using different plasma settings. Using three different values of bond force, multiple gold ball bonding were performed on the series of different surface roughness on aluminium bond pad for three trials. A modified box-plot was plotted for average ball shear value against surface roughness range. All three trials depicted similar polynomial plot trend with a leading negative coefficient. Using simple differentiation coupled with the standard deviation value from the trials, an optimized range for surface roughness was obtained from the equations created. The optimized ranges of surface roughness deduced from this experiment were from 2.10 nm till 6.38 nm. A final footprint experiment was done to understand and correlate to the ball shear experiments. The footprint experiment shows a better understanding of adhesion without shear value. Footprint adhesion scales were tabled and ranked, using this footprint adhesion plot against surface roughness was plotted. The plot depicted similar polynomial trend as the previous experiments. The highest footprint adhesion was also within the range obtained previously. The adhesion of footprint more than 80% gold ball remnant on the aluminium bond pad were within the optimized surface roughness range of 2.10 nm till 6.38 nm. It can be finally concluded that surface roughness at micro level becomes an important critical attribute to ensure the wire bond quality. The experimental approach has also given new means of obtaining the suitable optimized surface roughness range for a quality and robust wire bond adhesion onto bond pads. The work has successfully established surface roughness importance in the wire bonding process.
format	Thesis
author	Vithyacharan, Retnasamy
author_facet	Vithyacharan, Retnasamy
author_sort	Vithyacharan, Retnasamy
title	Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad
title_short	Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad
title_full	Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad
title_fullStr	Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad
title_full_unstemmed	Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad
title_sort	surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad
granting_institution	Universiti Malaysia Perlis (UniMAP)
granting_department	School of Microelectronic Engineering
url	http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33139/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/33139/2/Full%20text.pdf
_version_	1747836804096065536

Surface roughness and adhesion analysis study on ultrasonic gold ball onto aluminium bond pad

Similar Items