Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
The composite technology is the new approach to improve the service temperature capabilities and thermal stability of the solder joints. Low-silver Sn98.3-Ag1.0-Cu0.7 (SAC107) and Sn99.3-Cu0.7 (Sn-0.7Cu) solders were used as matrix while silicon nitride (Si3N4) with different weight fractions (0, 0...
محفوظ في:
| التنسيق: | أطروحة |
|---|---|
| اللغة: | English |
| الموضوعات: | |
| الوصول للمادة أونلاين: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77984/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77984/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/77984/4/Norhayanti.pdf |
| الوسوم: |
إضافة وسم
لا توجد وسوم, كن أول من يضع وسما على هذه التسجيلة!
|