Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
Nowadays, composite solder has gain researcher’s attention due to its promising improvement in physical and mechanical properties for lead free solder. This study was carried out to investigate the effect of SiC particle on microstructure evolution, physical and mechanical properties of SAC and SnCu...
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| التنسيق: | أطروحة |
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| اللغة: | English |
| الموضوعات: | |
| الوصول للمادة أونلاين: | http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/78028/1/Page%201-24.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/78028/2/Full%20text.pdf http://dspace.unimap.edu.my:80/xmlui/bitstream/123456789/78028/3/Zawawi.pdf |
| الوسوم: |
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