Failure Analysis Investigation on 2N7002LTI TMOS Device Due to Electrostatic Discharge (ESD) Failures

The common failures in the electronic devices e.g. Metal Oxide Semiconductor(MOS), and T type Metal Oxide Semiconductor Field Effect Transistor (TMOS) are due to Electrostatic Discharge(ESD) and Electrical Overseers(EOS). A review is carried out giving an account of various types of failures and f...

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Main Author: Abdul Manaf, Abdul Halim
Format: Thesis
Language:English
English
Published: 1998
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Online Access:http://psasir.upm.edu.my/id/eprint/10121/1/FK_1998_5_A.pdf
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spelling my-upm-ir.101212011-03-10T00:53:00Z Failure Analysis Investigation on 2N7002LTI TMOS Device Due to Electrostatic Discharge (ESD) Failures 1998-04 Abdul Manaf, Abdul Halim The common failures in the electronic devices e.g. Metal Oxide Semiconductor(MOS), and T type Metal Oxide Semiconductor Field Effect Transistor (TMOS) are due to Electrostatic Discharge(ESD) and Electrical Overseers(EOS). A review is carried out giving an account of various types of failures and failure analysis philosophies. investigation. methodology developed here, Seremban, between Gate to Source(BVGSS) Stress Test, Parametric Abnormality Test (PA T) to induce failure. It h as been observed that the 2N7002LTl lMOS device does not fail within 45 volts of positively as well as negatively biased voltage condition when applied to the gate and source of the device, during BVGSS Stress Test. On the other hand the Voltage Susceptibility Test has given a limiting voltage of 110 volts, for the device to fail. The failure of the devices have been studied using the failure analysis philosophy developed here and it is observed that the failure is due to thinning of the gate oxide layer. The detailed scanning electron microscope (SEM) study has been carried out to comment on the additional mechanics of failure. The amount thinning of the gate oxide layer in the various regions of the device has been found to be in the range of 800 to 950 Angstroms. Semiconductors - Failures - Case studies 1998-04 Thesis http://psasir.upm.edu.my/id/eprint/10121/ http://psasir.upm.edu.my/id/eprint/10121/1/FK_1998_5_A.pdf application/pdf en public masters Universiti Putra Malaysia Semiconductors - Failures - Case studies Faculty of Engineering English
institution Universiti Putra Malaysia
collection PSAS Institutional Repository
language English
English
topic Semiconductors - Failures - Case studies


spellingShingle Semiconductors - Failures - Case studies


Abdul Manaf, Abdul Halim
Failure Analysis Investigation on 2N7002LTI TMOS Device Due to Electrostatic Discharge (ESD) Failures
description The common failures in the electronic devices e.g. Metal Oxide Semiconductor(MOS), and T type Metal Oxide Semiconductor Field Effect Transistor (TMOS) are due to Electrostatic Discharge(ESD) and Electrical Overseers(EOS). A review is carried out giving an account of various types of failures and failure analysis philosophies. investigation. methodology developed here, Seremban, between Gate to Source(BVGSS) Stress Test, Parametric Abnormality Test (PA T) to induce failure. It h as been observed that the 2N7002LTl lMOS device does not fail within 45 volts of positively as well as negatively biased voltage condition when applied to the gate and source of the device, during BVGSS Stress Test. On the other hand the Voltage Susceptibility Test has given a limiting voltage of 110 volts, for the device to fail. The failure of the devices have been studied using the failure analysis philosophy developed here and it is observed that the failure is due to thinning of the gate oxide layer. The detailed scanning electron microscope (SEM) study has been carried out to comment on the additional mechanics of failure. The amount thinning of the gate oxide layer in the various regions of the device has been found to be in the range of 800 to 950 Angstroms.
format Thesis
qualification_level Master's degree
author Abdul Manaf, Abdul Halim
author_facet Abdul Manaf, Abdul Halim
author_sort Abdul Manaf, Abdul Halim
title Failure Analysis Investigation on 2N7002LTI TMOS Device Due to Electrostatic Discharge (ESD) Failures
title_short Failure Analysis Investigation on 2N7002LTI TMOS Device Due to Electrostatic Discharge (ESD) Failures
title_full Failure Analysis Investigation on 2N7002LTI TMOS Device Due to Electrostatic Discharge (ESD) Failures
title_fullStr Failure Analysis Investigation on 2N7002LTI TMOS Device Due to Electrostatic Discharge (ESD) Failures
title_full_unstemmed Failure Analysis Investigation on 2N7002LTI TMOS Device Due to Electrostatic Discharge (ESD) Failures
title_sort failure analysis investigation on 2n7002lti tmos device due to electrostatic discharge (esd) failures
granting_institution Universiti Putra Malaysia
granting_department Faculty of Engineering
publishDate 1998
url http://psasir.upm.edu.my/id/eprint/10121/1/FK_1998_5_A.pdf
_version_ 1747811051956600832