Intermetallics evolution and shear strength of carbon nanotubes- reinforced sn-5sb solder on copper board
Critical evaluation of interconnection materials developed from composite solder materials and a comprehensive comparison of the joints with the host solder alloy are cardinal to the quest of divulging a more decent and dependable alternative to the existing solder candidate. In this study, the effe...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2015
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| Subjects: | |
| Online Access: | http://psasir.upm.edu.my/id/eprint/56593/1/FK%202015%2014RR.pdf |
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