Heat Pipes In Electronic Packaging
Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2006
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| Subjects: | |
| Online Access: | http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf |
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