Heat Pipes In Electronic Packaging

Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.

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Bibliographic Details
Main Author: Munusamy, Sri Jaiandran
Format: Thesis
Language:English
Published: 2006
Subjects:
Online Access:http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf
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id my-usm-ep.29322
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spelling my-usm-ep.293222017-03-22T02:23:55Z Heat Pipes In Electronic Packaging 2006-01 Munusamy, Sri Jaiandran Q Science Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. 2006-01 Thesis http://eprints.usm.my/29322/ http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf application/pdf en public masters USM Pusat Pengajian Sains Fizik
institution Universiti Sains Malaysia
collection USM Institutional Repository
language English
topic Q Science
spellingShingle Q Science
Munusamy, Sri Jaiandran
Heat Pipes In Electronic Packaging
description Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.
format Thesis
qualification_level Master's degree
author Munusamy, Sri Jaiandran
author_facet Munusamy, Sri Jaiandran
author_sort Munusamy, Sri Jaiandran
title Heat Pipes In Electronic Packaging
title_short Heat Pipes In Electronic Packaging
title_full Heat Pipes In Electronic Packaging
title_fullStr Heat Pipes In Electronic Packaging
title_full_unstemmed Heat Pipes In Electronic Packaging
title_sort heat pipes in electronic packaging
granting_institution USM
granting_department Pusat Pengajian Sains Fizik
publishDate 2006
url http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf
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