Heat Pipes In Electronic Packaging
Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.
Saved in:
Main Author: | Munusamy, Sri Jaiandran |
---|---|
Format: | Thesis |
Language: | English |
Published: |
2006
|
Subjects: | |
Online Access: | http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].
by: Munusamy, Sri Jaiandran
Published: (2006) -
Piped water cooling of concrete dams for steady state heat equations
by: Mohamad Hanafi, Nurfatihah
Published: (2012) -
Effect of packaging on the alkaloidal content of ketum leaves (mitragyna speciosa k.)
by: Mohd. Rohani , Noor Aziah
Published: (2010) -
Optimal heat transfer of heat sink design based on electronic package thermal distribution using COMSOL package software
by: Rosli, Rashidah
Published: (2015) -
Optimisation of hybrid microchannel heat sink with secondary channel under laminar flow condition
by: Aziz Japar, Wan Mohd. Arif
Published: (2022)