Heat Pipes In Electronic Packaging

Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes.

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书目详细资料
主要作者: Munusamy, Sri Jaiandran
格式: Thesis
语言:English
出版: 2006
主题:
在线阅读:http://eprints.usm.my/29322/1/Heat_pipes_in_electronic_packaging.pdf
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