Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
Pencirian aloi pateri tanpa plumbum (Sn-9Zn, Sn-8Zn-3Bi dan Sn-3Ag-0.5Cu) ke atas substrat kumprum tanpa salutan dan yang disalut dengan Au-Ni telah dilakukan. Keputusan menunjukkan kebolehbasahan bagi ketiga-tiga aloi pateri ke atas substrat kuprum adalah baik pada suhu yang telah ditetapkan. Ukura...
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my-usm-ep.415122019-04-12T05:26:59Z Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates 2009-11 Binh, Duong Ngoc TN1-997 Mining engineering. Metallurgy Pencirian aloi pateri tanpa plumbum (Sn-9Zn, Sn-8Zn-3Bi dan Sn-3Ag-0.5Cu) ke atas substrat kumprum tanpa salutan dan yang disalut dengan Au-Ni telah dilakukan. Keputusan menunjukkan kebolehbasahan bagi ketiga-tiga aloi pateri ke atas substrat kuprum adalah baik pada suhu yang telah ditetapkan. Ukuran sudut sentuh dan daya basahan menunjukkan pembasahan yang baik telah tercapai. Properties of lead free solder alloys (Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu) on Au-Ni surface finished copper and copper substrates were investigated. Results obtained showed good wetting of all three solder alloys on Au-Ni surface finished substrate at appropriate temperatures. Contact angle measurement and wetting force results reaffirmed that good wetting of solder alloys on substrate was achieved. 2009-11 Thesis http://eprints.usm.my/41512/ http://eprints.usm.my/41512/1/Duong_Ngoc_Binh24.pdf application/pdf en public phd doctoral Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral |
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Universiti Sains Malaysia |
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USM Institutional Repository |
language |
English |
topic |
TN1-997 Mining engineering Metallurgy |
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TN1-997 Mining engineering Metallurgy Binh, Duong Ngoc Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates |
description |
Pencirian aloi pateri tanpa plumbum (Sn-9Zn, Sn-8Zn-3Bi dan Sn-3Ag-0.5Cu) ke atas substrat kumprum tanpa salutan dan yang disalut dengan Au-Ni telah dilakukan. Keputusan menunjukkan kebolehbasahan bagi ketiga-tiga aloi pateri ke atas substrat kuprum adalah baik pada suhu yang telah ditetapkan. Ukuran sudut sentuh dan daya basahan menunjukkan pembasahan yang baik telah tercapai.
Properties of lead free solder alloys (Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu) on Au-Ni surface finished copper and copper substrates were investigated. Results obtained showed good wetting of all three solder alloys on Au-Ni surface finished substrate at appropriate temperatures. Contact angle measurement and wetting force results reaffirmed that good wetting of solder alloys on substrate was achieved. |
format |
Thesis |
qualification_name |
Doctor of Philosophy (PhD.) |
qualification_level |
Doctorate |
author |
Binh, Duong Ngoc |
author_facet |
Binh, Duong Ngoc |
author_sort |
Binh, Duong Ngoc |
title |
Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
|
title_short |
Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
|
title_full |
Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
|
title_fullStr |
Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
|
title_full_unstemmed |
Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
|
title_sort |
interfacial reactions and electromigration in lead-free solder joints with copper and au-ni surface finished copper substrates |
granting_institution |
Universiti Sains Malaysia |
granting_department |
Pusat Pengajian Kejuruteraan Bahan & Sumber Mineral |
publishDate |
2009 |
url |
http://eprints.usm.my/41512/1/Duong_Ngoc_Binh24.pdf |
_version_ |
1747820925015818240 |