Interfacial Reactions And Electromigration In Lead-Free Solder Joints With Copper And Au-Ni Surface Finished Copper Substrates
Pencirian aloi pateri tanpa plumbum (Sn-9Zn, Sn-8Zn-3Bi dan Sn-3Ag-0.5Cu) ke atas substrat kumprum tanpa salutan dan yang disalut dengan Au-Ni telah dilakukan. Keputusan menunjukkan kebolehbasahan bagi ketiga-tiga aloi pateri ke atas substrat kuprum adalah baik pada suhu yang telah ditetapkan. Ukura...
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Main Author: | Binh, Duong Ngoc |
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Format: | Thesis |
Language: | English |
Published: |
2009
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Subjects: | |
Online Access: | http://eprints.usm.my/41512/1/Duong_Ngoc_Binh24.pdf |
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