Characterization Of Ti/TiN/AlCu Film Stack Prepared By Physical Vapor Deposition

Characterization Of Ti/TiN/AlCu Film Stack Prepared By Physical Vapor Deposition

Physical vapor deposition (PVD) method is widely used in semiconductor industry in metallic film deposition process. It has been found that the metallic film properties are influenced by the parameter change in the PVD sputtering machine. Ionized physical vapor deposition (I-PVD) came about when ele...

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书目详细资料
主要作者:	Leow, Mun Tyng
格式:	Thesis
语言:	English
出版:	2012
主题:	QC1 Physics (General)
在线阅读:	http://eprints.usm.my/41945/1/LEOW_MUN_TYNG.pdf
标签:	添加标签没有标签, 成为第一个标记此记录!

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