Ultrafiltration Treatment For Spent Tungsten Slurry Generated By Chemical Polishing Process In Wafer Fabrication Industry For Reuse

Chemical Mechanical Polishing (CMP) is a widely used process to planarize wafers for microelectronic applications. It involves the polishing of metallic surface by chemical action followed by the removal of the modified layer by mechanical action using tungsten slurry. It is a rather complex mixt...

Full description

Saved in:
Bibliographic Details
Main Author: Sanusi, Nur Fatin Amalina Muhammad
Format: Thesis
Published: 2017
Online Access:http://eprints.usm.my/45754/1/Ultrafiltration%20Treatment%20For%20Spent%20Tungsten%20Slurry%20Generated%20By%20Chemical%20Polishing%20Process%20In%20Wafer%20Fabrication%20Industry%20For%20Reuse.pdf
Tags: Add Tag
No Tags, Be the first to tag this record!