An Optical Set-Up For Inspecting Edge Chipping Defects Of Dws Solar Wafer

Diamond-Wire Sawn (DWS) technique in Photovoltaic (PV) wafer slicing has the capability to slice out thinner wafers at a faster speed and lower kerf lost. However, thinner wafers will cause higher breakage rate. In-line inspection of defects such as wafer’s edge chipping has become more important...

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Main Author:	Lim, Thai Li
Format:	Thesis
Language:	English
Published:	2019
Subjects:	T Technology
Online Access:	http://eprints.usm.my/50617/1/An%20Optical%20Set-Up%20For%20Inspecting%20Edge%20Chipping%20Defects%20Of%20Dws%20Solar%20Wafer.pdf
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spelling	my-usm-ep.506172021-11-17T03:42:12Z An Optical Set-Up For Inspecting Edge Chipping Defects Of Dws Solar Wafer 2019-05-01 Lim, Thai Li T Technology TK Electrical Engineering. Electronics. Nuclear Engineering Diamond-Wire Sawn (DWS) technique in Photovoltaic (PV) wafer slicing has the capability to slice out thinner wafers at a faster speed and lower kerf lost. However, thinner wafers will cause higher breakage rate. In-line inspection of defects such as wafer’s edge chipping has become more important. This research focuses on the optical set-up for silicon solar wafer’s edge chipping inspection system, resulting in the proposal of a novel set-up. It was discovered that the optimum camera set-up is at 45° and this angular view achieved surface visibility above 70% for all the three surfaces of a wafer’s edge, i.e., the top, side, and bottom surfaces. The use of dome light in the set-up was proven effective in generating best image quality for DWS surface with SNR of 14.4dB. Also, the back-lit illumination resulted in the best contrast averaging at 85.0%. The proposed set-up is applicable to run in-line on 353.7 mm/s of conveyor speed, which is equivalent to 4200 UPH production with the wafers pitch of 300 mm per unit. It achieved 100% detection for the three major types of chippings which are (i) the non-through, (ii) the through, and (iii) the side chipping, for chipping samples with size between 33 μm to 780 μm. The correctness of defect region segmentation scores 68.1% with false negative about 31.9% while the false positive maintained at 2.3%. 2019-05 Thesis http://eprints.usm.my/50617/ http://eprints.usm.my/50617/1/An%20Optical%20Set-Up%20For%20Inspecting%20Edge%20Chipping%20Defects%20Of%20Dws%20Solar%20Wafer.pdf application/pdf en public phd doctoral Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Elektrik & Elektronik
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	T Technology T Technology
spellingShingle	T Technology T Technology Lim, Thai Li An Optical Set-Up For Inspecting Edge Chipping Defects Of Dws Solar Wafer
description	Diamond-Wire Sawn (DWS) technique in Photovoltaic (PV) wafer slicing has the capability to slice out thinner wafers at a faster speed and lower kerf lost. However, thinner wafers will cause higher breakage rate. In-line inspection of defects such as wafer’s edge chipping has become more important. This research focuses on the optical set-up for silicon solar wafer’s edge chipping inspection system, resulting in the proposal of a novel set-up. It was discovered that the optimum camera set-up is at 45° and this angular view achieved surface visibility above 70% for all the three surfaces of a wafer’s edge, i.e., the top, side, and bottom surfaces. The use of dome light in the set-up was proven effective in generating best image quality for DWS surface with SNR of 14.4dB. Also, the back-lit illumination resulted in the best contrast averaging at 85.0%. The proposed set-up is applicable to run in-line on 353.7 mm/s of conveyor speed, which is equivalent to 4200 UPH production with the wafers pitch of 300 mm per unit. It achieved 100% detection for the three major types of chippings which are (i) the non-through, (ii) the through, and (iii) the side chipping, for chipping samples with size between 33 μm to 780 μm. The correctness of defect region segmentation scores 68.1% with false negative about 31.9% while the false positive maintained at 2.3%.
format	Thesis
qualification_name	Doctor of Philosophy (PhD.)
qualification_level	Doctorate
author	Lim, Thai Li
author_facet	Lim, Thai Li
author_sort	Lim, Thai Li
title	An Optical Set-Up For Inspecting Edge Chipping Defects Of Dws Solar Wafer
title_short	An Optical Set-Up For Inspecting Edge Chipping Defects Of Dws Solar Wafer
title_full	An Optical Set-Up For Inspecting Edge Chipping Defects Of Dws Solar Wafer
title_fullStr	An Optical Set-Up For Inspecting Edge Chipping Defects Of Dws Solar Wafer
title_full_unstemmed	An Optical Set-Up For Inspecting Edge Chipping Defects Of Dws Solar Wafer
title_sort	optical set-up for inspecting edge chipping defects of dws solar wafer
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Elektrik & Elektronik
publishDate	2019
url	http://eprints.usm.my/50617/1/An%20Optical%20Set-Up%20For%20Inspecting%20Edge%20Chipping%20Defects%20Of%20Dws%20Solar%20Wafer.pdf
_version_	1747822042531495936

An Optical Set-Up For Inspecting Edge Chipping Defects Of Dws Solar Wafer

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