Effect of indium addition on microstructure, wettability, shear strength and creep behavior of sn100c solder
Due to environmental concern of lead toxicity, the use of lead-free solder has been widely used in electronic packing industries. In finding alternative of lead-free solder to replace the current lead solder, the lead-free solder should have a melting point close to lead solder (183°C), has good wet...
Saved in:
| Main Author: | |
|---|---|
| Format: | Thesis |
| Language: | English |
| Published: |
2019
|
| Subjects: | |
| Online Access: | http://eprints.usm.my/55444/1/Effect%20of%20indium%20addition%20on%20microstructure%2C%20wettability%2C%20shear%20strength%20and%20creep%20behavior%20of%20sn100c%20solder.pdf |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|