Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].

Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. Keadaan ini menyebabkan peningkatan dalam flux haba. Sehubungan itu, para jurutera menghadapi satu cabaran baru untuk menangani masalah dalam pembungkusan chip. The electronic industry is developing towards hi...

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Bibliographic Details
Main Author:	Munusamy, Sri Jaiandran
Format:	Thesis
Language:	English
Published:	2006
Subjects:	TJ255-265 Heat engines
Online Access:	http://eprints.usm.my/9052/1/HEAT_PIPES_IN_ELECTRONIC_PACKAGING.pdf
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id	my-usm-ep.9052
record_format	uketd_dc
spelling	my-usm-ep.90522017-04-17T09:26:38Z Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. 2006-01 Munusamy, Sri Jaiandran TJ255-265 Heat engines Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. Keadaan ini menyebabkan peningkatan dalam flux haba. Sehubungan itu, para jurutera menghadapi satu cabaran baru untuk menangani masalah dalam pembungkusan chip. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. Therefore, the challenge has come for the engineers to overcome the problem in chip packaging. 2006-01 Thesis http://eprints.usm.my/9052/ http://eprints.usm.my/9052/1/HEAT_PIPES_IN_ELECTRONIC_PACKAGING.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Mekanikal
institution	Universiti Sains Malaysia
collection	USM Institutional Repository
language	English
topic	TJ255-265 Heat engines
spellingShingle	TJ255-265 Heat engines Munusamy, Sri Jaiandran Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].
description	Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. Keadaan ini menyebabkan peningkatan dalam flux haba. Sehubungan itu, para jurutera menghadapi satu cabaran baru untuk menangani masalah dalam pembungkusan chip. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. Therefore, the challenge has come for the engineers to overcome the problem in chip packaging.
format	Thesis
qualification_level	Master's degree
author	Munusamy, Sri Jaiandran
author_facet	Munusamy, Sri Jaiandran
author_sort	Munusamy, Sri Jaiandran
title	Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].
title_short	Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].
title_full	Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].
title_fullStr	Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].
title_full_unstemmed	Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].
title_sort	heat pipes in electronic packaging [tj264. s774 2007 f rb].
granting_institution	Universiti Sains Malaysia
granting_department	Pusat Pengajian Kejuruteraan Mekanikal
publishDate	2006
url	http://eprints.usm.my/9052/1/HEAT_PIPES_IN_ELECTRONIC_PACKAGING.pdf
_version_	1747819745936146432

Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].

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