Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].
Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. Keadaan ini menyebabkan peningkatan dalam flux haba. Sehubungan itu, para jurutera menghadapi satu cabaran baru untuk menangani masalah dalam pembungkusan chip. The electronic industry is developing towards hi...
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my-usm-ep.90522017-04-17T09:26:38Z Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. 2006-01 Munusamy, Sri Jaiandran TJ255-265 Heat engines Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. Keadaan ini menyebabkan peningkatan dalam flux haba. Sehubungan itu, para jurutera menghadapi satu cabaran baru untuk menangani masalah dalam pembungkusan chip. The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. Therefore, the challenge has come for the engineers to overcome the problem in chip packaging. 2006-01 Thesis http://eprints.usm.my/9052/ http://eprints.usm.my/9052/1/HEAT_PIPES_IN_ELECTRONIC_PACKAGING.pdf application/pdf en public masters Universiti Sains Malaysia Pusat Pengajian Kejuruteraan Mekanikal |
| institution |
Universiti Sains Malaysia |
| collection |
USM Institutional Repository |
| language |
English |
| topic |
TJ255-265 Heat engines |
| spellingShingle |
TJ255-265 Heat engines Munusamy, Sri Jaiandran Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. |
| description |
Industri electronik berkembang ke arah qualiti dan kelajuan
computational yang tinggi. Keadaan ini menyebabkan peningkatan dalam flux haba. Sehubungan itu, para jurutera menghadapi satu cabaran baru untuk menangani masalah dalam pembungkusan chip.
The electronic industry is developing towards higher quality and computational speed. It has led to the increase in chip heat fluxes. Therefore, the challenge has come for the engineers to overcome the problem in chip packaging.
|
| format |
Thesis |
| qualification_level |
Master's degree |
| author |
Munusamy, Sri Jaiandran |
| author_facet |
Munusamy, Sri Jaiandran |
| author_sort |
Munusamy, Sri Jaiandran |
| title |
Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. |
| title_short |
Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. |
| title_full |
Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. |
| title_fullStr |
Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. |
| title_full_unstemmed |
Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb]. |
| title_sort |
heat pipes in electronic packaging [tj264. s774 2007 f rb]. |
| granting_institution |
Universiti Sains Malaysia |
| granting_department |
Pusat Pengajian Kejuruteraan Mekanikal |
| publishDate |
2006 |
| url |
http://eprints.usm.my/9052/1/HEAT_PIPES_IN_ELECTRONIC_PACKAGING.pdf |
| _version_ |
1747819745936146432 |