Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].

Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].

Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. Keadaan ini menyebabkan peningkatan dalam flux haba. Sehubungan itu, para jurutera menghadapi satu cabaran baru untuk menangani masalah dalam pembungkusan chip. The electronic industry is developing towards hi...

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書目詳細資料
主要作者:	Munusamy, Sri Jaiandran
格式:	Thesis
語言:	English
出版:	2006
主題:	TJ255-265 Heat engines
在線閱讀:	http://eprints.usm.my/9052/1/HEAT_PIPES_IN_ELECTRONIC_PACKAGING.pdf
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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