Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].

Heat Pipes In Electronic Packaging [TJ264. S774 2007 f rb].

Industri electronik berkembang ke arah qualiti dan kelajuan computational yang tinggi. Keadaan ini menyebabkan peningkatan dalam flux haba. Sehubungan itu, para jurutera menghadapi satu cabaran baru untuk menangani masalah dalam pembungkusan chip. The electronic industry is developing towards hi...

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书目详细资料
主要作者:	Munusamy, Sri Jaiandran
格式:	Thesis
语言:	English
出版:	2006
主题:	TJ255-265 Heat engines
在线阅读:	http://eprints.usm.my/9052/1/HEAT_PIPES_IN_ELECTRONIC_PACKAGING.pdf
标签:	添加标签没有标签, 成为第一个标记此记录!

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