The micro-structural characterization of thermosonic cu-al intermetallic compounds and modelling of its interface stress
Thermosonic bonding of the Cu wire on Al bond pad is a common technology used in semiconductor industry. However, recent research show voids formation at this bonding interface on micro-chip, after an annealing treatment of High Temperature Storage (HTS). This voids formation is believed due to the...
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| Format: | Thesis |
| Language: | English English |
| Published: |
2015
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/16883/1/The%20Micro-Structural%20Characterization%20Of%20Thermosonic%20Cu-Al%20Intermetallic%20Compounds%20And%20Modelling%20Of%20Its%20Interface%20Stress.pdf http://eprints.utem.edu.my/id/eprint/16883/2/The%20micro-structural%20characterization%20of%20thermosonic%20Cu-Al%20intermetallic%20compounds%20and%20modelling%20of%20its%20interface%20stress.pdf |
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http://eprints.utem.edu.my/id/eprint/16883/1/The%20Micro-Structural%20Characterization%20Of%20Thermosonic%20Cu-Al%20Intermetallic%20Compounds%20And%20Modelling%20Of%20Its%20Interface%20Stress.pdfhttp://eprints.utem.edu.my/id/eprint/16883/2/The%20micro-structural%20characterization%20of%20thermosonic%20Cu-Al%20intermetallic%20compounds%20and%20modelling%20of%20its%20interface%20stress.pdf