Influence Of Gold Silver Plating Thickness On Palladium Coated Copper Wire On Stitch Bonding

Influence Of Gold Silver Plating Thickness On Palladium Coated Copper Wire On Stitch Bonding

Low cost, high reliable and robust semiconductor packages are required in order for semiconductor manufacturer to stay competitive in the industry. This requires a stable manufacturing process that able to maintain high production yield, reduce customer reject and scrap cost. Currently, combination...

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书目详细资料
主要作者:	Tey, Sock Chien
格式:	Thesis
语言:	English English
出版:	2016
主题:	T Technology (General) TS Manufactures
在线阅读:	http://eprints.utem.edu.my/id/eprint/18372/1/Influence%20Of%20Gold%20Silver%20Plating%20Thickness%20On%20Palladium%20Coated%20Copper%20Wire%20On%20Stitch%20Bonding.pdf http://eprints.utem.edu.my/id/eprint/18372/2/Influence%20Of%20Gold%20Silver%20Plating%20Thickness%20On%20Palladium%20Coated%20Copper%20Wire%20On%20Stitch%20Bonding.pdf
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